Kevin Chemicals proudly introduces the KCSN Chemistry, a revolutionary immersion tin process designed specifically for the Printed Circuit Board (PCB) industry. This innovative chemistry replaces traditional Hot Air Leveling processes, offering a lead-free solution that delivers a 100% flat surface, uniform thickness, and impeccable finish on SMD pads and component holes.

• Lead-Free Advancement: KCSN Chemistry aligns with environmentally conscious practices by providing a lead-free immersion tin process, ensuring compliance with modern industry standards.
• Surface Perfection: Achieve a flawless surface with KCSN Chemistry. The process ensures a uniform tin thickness, resulting in a smooth and even surface on SMD pads and component holes.
• Whisker-Free Assurance: Our immersion tin process guarantees a whisker-free finish, eliminating the risk of undesirable whisker formations that can compromise the integrity of your PCBs.
• Stability and Solderability: Benefit from a stable chemistry that ensures consistent results and excellent solderability, meeting the high-quality standards required in the PCB industry.
• Simplicity in Process Control: KCSN Chemistry simplifies the immersion tin process with easy process control. The chemistry is stable, and its reliability allows for efficient control without the need for extensive chemical analysis.

• Tin Thickness: Achieve a tin thickness of 0.5 to 1.0 micron within a short dwell time of 10 to 15 minutes.
• Process Equipment: The immersion tin process utilizing KCSN Chemistry requires PP tanks, glass heaters, and circulation pumps to facilitate the process effectively.